Hoʻolālā ʻo Chipmaker Infineon i ka 50% hoʻonui kālā

Kuhi ʻia ka loaʻa kālā o ka mākeke semiconductor honua e ulu e 17.3 pakeneka i kēia makahiki ma mua o 10.8 pakeneka ma 2020, e like me ka hōʻike mai International Data Corp, kahi hui noiʻi mākeke.

 

ʻO nā chips me ka hoʻomanaʻo kiʻekiʻe ke alakaʻi ʻia e kā lākou hoʻohana nui ʻana i nā kelepona paʻalima, nā puke puke, nā kikowaena, nā kaʻa, nā hale akamai, nā pāʻani, nā lole komo, a me nā wahi komo Wi-Fi.

 

E piʻi ka mākeke semiconductor i $ 600 biliona e 2025, me ka nui o ka ulu ʻana o ka makahiki he 5.3 pakeneka mai kēia makahiki a hiki i 2025.

 

Kuhi ʻia ka loaʻa kālā o ka honua o 5G semiconductor e hoʻonui ʻia e 128 pakeneka o ka makahiki-ma-makahiki i kēia makahiki, me ka nui o nā semiconductors kelepona paʻa e manaʻo ʻia e ulu e 28.5 pakeneka.

 

Ma waena o ka hemahema o kēia manawa, nui nā hui semiconductor e hoʻoikaika nei i kā lākou hana e kūkulu i nā mana hana hou.

 

No ka laʻana, i ka pule i hala, ua wehe ʻo German chipmaker Infineon Technologies AG i kāna ʻenehana kiʻekiʻe, 300-milimeter wafers hale hana no ka uila uila ma kāna kahua ʻo Villach ma Austria.

 

Ma 1.6 biliona euros ($1.88 biliona), ʻo ka hoʻopukapuka i hana ʻia e ka hui semiconductor e hōʻike ana i kekahi o nā papahana nui loa i ka ʻāpana microelectronics ma ʻEulopa.

 

Ua ʻōlelo ʻo Fu Liang, kahi loiloi ʻenehana kūʻokoʻa, i ka maʻalahi o ka pōkole chip, e pōmaikaʻi nā ʻoihana he nui e like me ka automotive, smartphones a me nā kamepiula pilikino.

 


Ka manawa hoʻouna: Nov-22-2021

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